helpful (hopefully): | |
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a little Glossary |
BGA | Ball Grid Array |
Array of tiny balls in contact with some internal wiring of an electronics package. Each ball is meant to swim in a certain amount of solder during the reflow process. BGAs enable high PC / HD part-to-PCB connections with very low profile. |
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CPU | Central Processing Unit | The central Part that runs the computer, often also referred to as µP. | |||
HTML | Hyper Text Markup Language |
Innovative concept for retrieval of keywords in a single text,
and, beyond that, inter-networking in a lot of scientific texts originally. Invented by Tim Berners-Lee of CERN at Geneva, Switzerland. The very basis for the explosive success of the WWW on the internet. |
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µP | Micro-Processor | Highly integrated circuit capable of processing data through executing code. | |||
PC | Pin Count |
Number of connections between a component and the PCB must be high for VLSI components in high speed applications. |
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PCB | Printed Circuitry Board |
Carrier for soldered-on components containing circuitry wiring. May be single- or double-sided or of multilayer design. Modern designs are of SMT type, components placed by robots then reflow soldered to the PCBs pads. |
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QFP | Quad Flat Pack |
A µchip in a quadratic or rectangular shaped housing (mostly of plastic) with connections on either edge of it. |
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SMT | Surface Mount Technology |
components which do not have wires to be solderd through PCB holes but are soldered directly to the PCBs pads and kept in place solely by that. |
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VLSI | Very large Scale Integration |
Millions of transistors on a chip the size of a fingernail |
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WWW | World Wide Web |
You are looking at it right now. |
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To be continued... (always under construction) |
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